ASML Holding N.V.

ASML Holding N.V. develops, produces, markets, sells, and services advanced semiconductor equipment systems for chipmakers. It offers advanced semiconductor equipment systems, including lithography, metrology, and inspection systems. The company also provides extreme ultraviolet lithography systems; and deep ultraviolet lithography systems comprising immersion and dry lithography solutions to manufacture various range of semiconductor nodes and technologies. In addition, it offers metrology and inspection systems, including YieldStar optical metrology systems to assess the quality of patterns on the wafers; and HMI electron beam solutions to locate and analyze individual chip defects. Further, the company provides computational lithography solutions, and lithography systems and control software solutions; and refurbishes and upgrades lithography systems, as well as offers customer support and related services. It operates in Japan, South Korea, Singapore, Taiwan, China, rest of Asia, the Netherlands, rest of Europe, the Middle East, Africa, and the United States. The company was formerly known as ASM Lithography Holding N.V. and changed its name to ASML Holding N.V. in 2001. ASML Holding N.V. was founded in 1984 and is headquartered in Veldhoven, the Netherlands.

Lam Research Corporation

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatments; and VECTOR plasma-enhanced CVD ALD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications; and Metryx mass metrology systems for high precision in-line mass measurement in semiconductor wafer manufacturing. The company sells its products and services to semiconductors industry in the United States, China, Europe, Japan, Korea, Southeast Asia, Taiwan, and internationally. Lam Research Corporation was incorporated in 1980 and is headquartered in Fremont, California.

ASML vs. LRCX Stock Comparison

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	ASML	LRCX
Basics
Name	ASML Holding N.V.	Lam Research Corporation
Price	$1,746.71	$338.67
Sector	Technology	Technology
Market cap	large / 673,212,890	large / 423,530,542
Beta	1.37	1.82
Dividends
Dividend	$8.79	$1.01
Yield	0.50%	0.30%
Frequency	Quarterly	Quarterly
Payout ratio	29.10%	19.06%
Dividend CAGR (3y)	17.39%	14.80%
Dividend CAGR (5y)
Dividend CAGR (10y)
Dividend safety score
Overall score
Forward payout ratio
Payout ratio/FCF
Dividend CAGR (3y)
Revenue CAGR (3y)
Debt/EBITDA
Debt/Equity
Valuation
P/E	57.86x	63.90x
P/S	13.32x	12.84x
P/B	22.26x	26.25x
P/CF	33.94x	37.39x
P/FCF	40.54x	39.63x
PEG ratio	42.40x	5.75x
EV/EBITDA	35.48x	35.42x
Fundamentals
Gross margin	52.83%	49.80%
Operating margin	34.60%	33.76%
Pretax margin	35.58%	34.10%
Net margin	29.42%	30.22%
Tax rate	17.32%	11.38%
ROE	52.14%	62.59%
ROA	19.01%	29.05%
Interest coverage	–	40.15x

	ASML	LRCX
Basics
Name	ASML Holding N.V.	Lam Research Corporation
Price	$1,746.71	$338.67
Sector	Technology	Technology
Market cap	large / 673,212,890	large / 423,530,542
Beta	1.37	1.82
Dividends
Dividend	$8.79	$1.01
Yield	0.50%	0.30%
Frequency	Quarterly	Quarterly
Payout ratio	29.10%	19.06%
Dividend CAGR (3y)	17.39%	14.80%
Dividend CAGR (5y)
Dividend CAGR (10y)
Dividend safety score
Overall score
Forward payout ratio
Payout ratio/FCF
Dividend CAGR (3y)
Revenue CAGR (3y)
Debt/EBITDA
Debt/Equity
Valuation
P/E	57.86x	63.90x
P/S	13.32x	12.84x
P/B	22.26x	26.25x
P/CF	33.94x	37.39x
P/FCF	40.54x	39.63x
PEG ratio	42.40x	5.75x
EV/EBITDA	35.48x	35.42x
Fundamentals
Gross margin	52.83%	49.80%
Operating margin	34.60%	33.76%
Pretax margin	35.58%	34.10%
Net margin	29.42%	30.22%
Tax rate	17.32%	11.38%
ROE	52.14%	62.59%
ROA	19.01%	29.05%
Interest coverage	–	40.15x

ASML vs. LRCX Stock Comparison

ASML vs. LRCX Stock Comparison

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