Is ASE Industrial Holding Co Ltd ADR a good dividend stock?

ASE Industrial Holding Co Ltd ADR (ASX) is a dividend-paying stock with a current dividend yield of 1.04%. Review its dividend history, payout consistency and growth to judge whether it fits your income strategy.

What is ASX's dividend yield?

The dividend yield for ASX stock is currently 1.04%.

How much does ASX pay in dividends per year?

ASE Industrial Holding Co Ltd ADR pays an annual dividend of $0.4171 per share over the trailing twelve months.

How often does ASX pay dividends?

ASX stock pays dividends annually.

Is ASX's dividend growing?

ASE Industrial Holding Co Ltd ADR's 3-year dividend CAGR is -8.66%.

ASX Stock Price, Chart, Stats & News

ASE Industrial Holding Co Ltd ADR

Save

Overview Dividend safety Dividends Fundamentals

ASE Industrial Holding Co Ltd ADR (ASX) is a dividend-paying stock with a current dividend yield of 1.04% as of Jul 15, 2026. It pays $0.4171 per share over the trailing twelve months and distributes annually. Its dividend has grown at a 21.17% 5-year compound annual rate.

88.39B

Market cap

59.25x

Current P/E

12.30x

Forward P/E

1.04%

Dividend yield

$0.4171

ASX dividend

Dividend safety

Moderate

Dividend coverage is moderate for ASX — it pays out about 61% of earnings.

See the safety analysis

ASX chart

Loading chart...

Fundamentals

Gross margin	17.26%
Operating margin	7.92%
Pretax margin	7.98%
Net margin	6.32%
Effective tax rate	18.46%
ROA	4.55%
ROE	12.75%
D/E	0.76x
Interest coverage ratio	9.03x

All financials

ASX valuation

P/E	59.25x
P/S	2.35x
P/B	4.33x
P/CF	11.10x
P/FCF	-101.10x
P/OCF	11.10x
PEG	0.08x
EV multiple	11.01x

About

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats.