Is ChipMOS TECHNOLOGIES Inc. a good dividend stock?

ChipMOS TECHNOLOGIES Inc. (IMOS) is a dividend-paying stock with a current dividend yield of 1.34%. Review its dividend history, payout consistency and growth to judge whether it fits your income strategy.

What is IMOS's dividend yield?

The dividend yield for IMOS stock is currently 1.34%.

How much does IMOS pay in dividends per year?

ChipMOS TECHNOLOGIES Inc. pays an annual dividend of $0.7826 per share over the trailing twelve months.

How often does IMOS pay dividends?

IMOS stock pays dividends annually.

Is IMOS's dividend growing?

ChipMOS TECHNOLOGIES Inc.'s 3-year dividend CAGR is -14.24%.

IMOS Stock Price, Chart, Stats & News

ChipMOS TECHNOLOGIES Inc.

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Overview Dividend safety Dividends Fundamentals

ChipMOS TECHNOLOGIES Inc. (IMOS) is a dividend-paying stock with a current dividend yield of 1.34% as of Jun 29, 2026. It pays $0.7826 per share over the trailing twelve months and distributes annually. Its dividend has grown at a 8.72% 5-year compound annual rate.

2.04B

Market cap

78.78x

Current P/E

11.38x

Forward P/E

1.34%

Dividend yield

$0.7826

IMOS dividend

Dividend safety

At-risk

IMOS pays out about 106% of earnings, leaving little safety margin.

See the safety analysis

IMOS chart

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Fundamentals

Gross margin	10.83%
Operating margin	4.77%
Pretax margin	2.45%
Net margin	2.07%
Effective tax rate	15.69%
ROA	1.10%
ROE	2.08%
D/E	0.68x
Interest coverage ratio	–

All financials

IMOS valuation

P/E	78.78x
P/S	1.67x
P/B	1.70x
P/CF	10.16x
P/FCF	254.03x
P/OCF	10.16x
PEG	0.02x
EV multiple	33.71x

About

ChipMOS TECHNOLOGIES INC. conducts research, development, manufacturing, and global sales of advanced, highly integrated, and precise integrated circuits. Headquartered in Hsinchu, Taiwan, and founded in 1997, the company also provides essential back-end assembly and testing services across key international markets, including Taiwan, mainland China, Japan, and Singapore. Its operations are structured across various segments, encompassing Testing, Assembly, Bumping, and specialized Testing and Assembly for LCD, OLED, and other display panel driver semiconductors, in addition to other related business areas.