2291
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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd.
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3.47%
Dividend yield
93.42%
Payout ratio
05/28/2024
Latest ex-date
HK$0.6259
Annual dividend
–
Payout frequency
2291 dividend history
Dividend growth (CAGR)
Yield history
Current yield: 3.47%
3.50%
3.50%
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